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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fukushima, T. Ohara, Y. Murugesan, M. Bea, J.-C. Lee, K.-W. Tanaka, T. Koyanagi, M. |
| Copyright Year | 2011 |
| Description | Author affiliation: Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University (Ohara, Y.; Tanaka, T.) || New Industry Creation Hatchery Center (NICHe), Tohoku University (Fukushima, T.; Murugesan, M.; Bea, J.-C.; Lee, K.-W.; Koyanagi, M.) |
| Abstract | We have demonstrated surface-tension-driven chip self-assembly for 3D stacking of a large number of known good dies (KGDs) on silicon substrates in batch processing. In this work, we employed small droplets of ultra-pure water as a liquid to precisely align chips having fine-pitch indium/gold microbumps with a size/pitch of 5/10 or 10/20μm. By using the self-assembly technique, these chips were aligned in a face-down configuration and flip-chip bonded onto hydrophilic bonding areas formed on silicon substrates. The hydrophilic areas are surrounded by hydrophobic areas that have above 100° in water contact angle. The wettability contrast between the hydrophilic and hydrophobic areas was found to be a key parameter to obtain high alignment accuracy. All chips having the indium/gold microbump arrays were self-assembled with high alignment accuracy of approximately 1μm or superior accuracy, and then, successfully bonded at 200 °C with thermal compression. The resulting resistance measured with the indium/gold daisy chain patterns was sufficiently low (< 20 mΩ/bump) and comparable to one obtained by a conventional mechanical alignment technique. |
| Starting Page | 2050 |
| Ending Page | 2055 |
| File Size | 1648013 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898799 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Self-assembly Gold Substrates Three dimensional displays Accuracy Indium |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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