Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Blackshear, E. Lombardi, T. Pompeo, F. Audet, J. KyungMooon Kim YoungHyuk Jeong JoonYoung Choi JoonYeob Lee ChangWoo Park Kondo, K. Matsumoto, S. Miyazawa, Y. |
| Copyright Year | 2011 |
| Description | Author affiliation: Amkor Technology, Inc (JoonYeob Lee; ChangWoo Park) || IBM Corporation (Blackshear, E.; Lombardi, T.; Pompeo, F.; Audet, J.) || Shinko Electric Industries Co., Ltd (Kondo, K.; Matsumoto, S.; Miyazawa, Y.) || STATS ChipPAC Ltd (KyungMooon Kim; YoungHyuk Jeong; JoonYoung Choi) |
| Abstract | The trend in large body, high performance integrated circuit packaging for the 32 nm semiconductor node and beyond is towards low dielectric loss to enable high bandwidth / low loss channels, and low thermal expansion to protect fragile, ultra-low dielectric constant (k) chip dielectric materials from differential expansion stress. A low coefficient of thermal expansion (CTE), low dielectric loss laminate composite was developed using industry standard Sequential Build Up (SBU) fabrication techniques and novel laminate materials. This laminate technology was used in assembly of a Flip Chip Plastic Ball Grid Array (FC PBGA) module including a silicon test structure developed for 32 nm Custom Logic development. The same silicon test structure and laminate design were also used to fabricate modules using conventional high volume laminate materials. Various laminate physical parameters including composite CTE were determined. The warpage shape of each laminate was initially characterized at room temperature, and over the temperature range from 25°C to 240°C. Warpage of critical package features was measured and tracked throughout the various steps of the lead free flip chip module assembly process for multiple laminate cross sections, core and buildup materials. A quantity of assemblies of each type was built and measured, data is reported. Advantages and disadvantages of each laminate module type and implications for robust package assembly as evidenced by these results are discussed. |
| Starting Page | 523 |
| Ending Page | 529 |
| File Size | 996499 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898561 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Laminates Shape Temperature measurement Dielectric losses Assembly |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|