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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Doany, F.E. Schow, C.L. Baks, C.W. Kuchta, D.M. Pepeljugoski, P. Schares, L. Budd, R. Libsch, F. Dangel, R. Horst, F. Offrein, B.J. Kash, J.A. |
| Copyright Year | 1999 |
| Abstract | We have developed parallel optical interconnect technologies designed to support terabit/s-class chip-to-chip data transfer through polymer waveguides integrated in printed circuit boards (PCBs). The board-level links represent a highly integrated packaging approach based on a novel parallel optical module, or Optomodule, with 16 transmitter and 16 receiver channels. Optomodules with 16 Tx+16 Rx channels have been assembled and fully characterized, with transmitters operating at data rates up to 20 Gb/s for a 27-1 PRBS pattern. Receivers characterized as fiber-coupled 16-channel transmitter-to-receiver links operated error-free up to 15 Gb/s, providing a 240 Gb/s aggregate bidirectional data rate. The low-profile Optomodule is directly surface mounted to a circuit board using convention ball grid array (BGA) solder process. Optical coupling to a dense array of polymer waveguides fabricated on the PCB is facilitated by turning mirrors and lens arrays integrated into the optical PCB. A complete optical link between two Optomodules interconnected through 32 polymer waveguides has been demonstrated with each unidirectional link operating at 10 Gb/s achieving a 160 Gb/s bidirectional data rate. The full module-to-module link provides the fastest, widest, and most integrated multimode optical bus demonstrated to date. |
| Sponsorship | IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society |
| Starting Page | 345 |
| Ending Page | 359 |
| Page Count | 15 |
| File Size | 2216103 |
| File Format | |
| ISSN | 15213323 |
| Volume Number | 32 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical polymers Optical interconnections Transceivers Optical waveguides Optical receivers Optical transmitters Optical arrays Integrated optics Printed circuits CMOS technology parallel optical interconnections Complementary metal–oxide–semiconductor (CMOS) analog integrated circuits integrated optoelectronics optical planar waveguides optical receivers optical transmitters optoelectronic packaging |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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