Please wait, while we are loading the content...
Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Dong Liu Haibin Chen Fei Wong Kan Lee Shiu, I. Jingshen Wu |
| Copyright Year | 2011 |
| Description | Author affiliation: NXP Semiconductors Hong Kong Ltd (Fei Wong; Kan Lee; Shiu, I.) || Department of Mechanical Engineering and CEMAR, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong (Dong Liu; Haibin Chen; Jingshen Wu) |
| Abstract | Wire bonding as one of the dominant interconnection technologies is gradually predominated by copper wire as a result of higher performance with lower cost than gold wire. Heat affected zone (HAZ) was formed due to the thermal conductivity during wire melting and free air ball (FAB) solidifying for ball bonding. The influence of the grain growth and recrystallization accompanied with HAZ formation would make the HAZ properties significantly different from that of thermally stable zone. However, it is still unclear how the material properties change with the HAZ. In the present study, mechanical properties of HAZ affected by different electronic flame-off (EFO) parameters were investigated. The length of HAZ was identified based on the results of micro-Vicker hardness as well as the grain size change from SEM micrographs. A patent-pending design of silicon clamp, which was fabricated with lithography and deep reactiveion etching (DRIE), was used to conduct the tensile test of HAZ. Deflection test was employed to accurately measure the Young's modulus of the HAZ using the nano-indenter tip. The beam length was controlled by the silicon clamps in the range of the length of HAZ ± 10 μm to make sure the Young's modulus was taken from the HAZ. The copper samples without EFO were used as control in the mechanical tests for comparison. The average of Young's modulus for the control sample was 149 GPa while the Young's modulus of the HAZ is 110 GPa. No notable difference in Young's modulus was observed among the HAZ samples made under different EFO settings. |
| Starting Page | 1523 |
| Ending Page | 1528 |
| File Size | 1565084 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898712 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wires Copper Young's modulus Clamps Silicon Loading Mechanical factors |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|