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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zheng Xu Jian-Qiang Lu Webb, B.C. Knickerbocker, J.U. |
| Copyright Year | 2011 |
| Description | Author affiliation: Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (Zheng Xu; Jian-Qiang Lu) || Department of SoP and 3D Integration, IBM T. J. Watson Research Center, Yorktown Heights, New York 10598 (Webb, B.C.; Knickerbocker, J.U.) |
| Abstract | Accurate modeling and estimation of 3D power network electrical performance are vitally important to aid the 3D integration and packaging design. In order to achieve high accuracy, we combine the electromagnetic (EM) and analytic simulations in this work to evaluate the electrical performance of a 3D power network, which consists of Cu through-strata-vias (TSVs), solders, micro-solders, and on-chip power grids. We intentionally partition the real stack-up structure of 3D power network into separated components, electromagnetically extract all the passive elements (resistance, inductance, conductance, and capacitance, i.e., RLGC) for each component at certain frequency points of interest. We then assemble all the components again into a corresponding SPICE model of 3D power network and import EM-extracted RLGC values to analyze the overall 3D system power performance. The number of stacked ICs, floorplanning of TSV/micro-solders, operating frequency of 3D system, and characteristics of decoupling capacitance are examined to unveil several 3D power delivery design implications. |
| Starting Page | 2171 |
| Ending Page | 2178 |
| File Size | 4366440 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898820 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Three dimensional displays Through-silicon vias Power grids Wires Copper Solid modeling |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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