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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Dong Lu Chenmin Liu Xianxin Lang Bo Wang Zhiying Li Lee, W.M.P. Lee, S.W.R. |
| Copyright Year | 2011 |
| Description | Author affiliation: Nano and Advanced Materials Institute Limited, Clear Water Bay, Hong Kong (Dong Lu; Chenmin Liu; Xianxin Lang; Bo Wang; Zhiying Li; Lee, W.M.P.) || Center for Advanced Microsystems Packaging, Hong Kong University of Science & Technology, Clear Water Bay, Hong Kong (Lee, S.W.R.) |
| Abstract | This research investigates novel nanomaterials filled conductive adhesives for application in High Brightness LEDs packaging. Low cost, green, and large scale synthesis as well as functionalization methods were developed to achieve various types of nano-fillers, including silver nanorod, nickel nanochain and nanosized silver particles. These nano-fillers can be used together with the conventional larger silver fillers as “nano-additives”, which can fill the gaps and form thermal and electrical “shortcuts” among the conventional large particles to create a continuous, direct, and multichannel heat dissipation pathway. As a result, the thermal conductivity of the whole DAA system was increased significantly. The morphologies, compositions, and interaction between the nanomaterials and the polymers were carefully studied using a series of techniques including Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and X-Ray Diffraction (XRD) etc. The thermal conductivity of the developed DAAs was analyzed by thermal conductivity measurement system. |
| Starting Page | 667 |
| Ending Page | 672 |
| File Size | 3403928 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898585 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Silver Thermal conductivity Light emitting diodes Conductivity Nickel Electronic packaging thermal management Heating |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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