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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jui-Hung Chien Chiao-Ling Lung Kun-Ju Tsai Chin-Chi Hsu Ting-Sheng Chen Yung-Fa Chou Ping-Hei Chen Shih-Chieh Chang Ding-Ming Kwai |
| Copyright Year | 2011 |
| Description | Author affiliation: Department of Mechanical Engineering, National Taiwan University, Taipei 10617, Taiwan (Chin-Chi Hsu; Ping-Hei Chen) || Department of Computer Science, National Tsing Hua University, HsinChu 30013, Taiwan (Shih-Chieh Chang) || Information and Communications, Research Laboratories, Industrial Technology Research, Institute, HsinChu 31040, Taiwan (Jui-Hung Chien; Chiao-Ling Lung; Kun-Ju Tsai; Ting-Sheng Chen; Yung-Fa Chou; Ding-Ming Kwai) |
| Abstract | Different from traditional static thermal solutions (STS) or dynamic thermal management (DTM), we propose a design of metallic thermal skeletons in order to conduct the heat generated by the virtual core array in this paper. Not only the proposed design can lower the maximum temperature of the hotspot, but improve the thermal uniformity of the test chip. Furthermore, the presented metallic thermal skeletons are composed of the BEOL metallization for connection with the on-chip heat sink. Virtual cores with temperature sensors are also designed to construct a 126-core array and, as the role of the virtual many-core system. The thermal sensor network is based on a ring oscillator whose oscillation frequency is sensitive to temperature. Simulations and theoretical computations have been performed to see the effectiveness of the proposed metallic thermal skeletons. Finally, the infrared radiation thermal images are employed for monitoring the temperature of the virtual cores and that of the metallic thermal skeletons. The experimental results show that the proposed type γ design provides excellent capability for enhancement of thermal conduction and largely enhances the thermal uniformity of the test chip. |
| Starting Page | 873 |
| Ending Page | 879 |
| File Size | 10273396 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898614 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Skeleton Metals Heating Thermal sensors Temperature measurement Heat transfer |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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