Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Myung Jin Yim Strode, R. Brand, J. Adimula, R. Zhang, J.J. Chan Yoo |
| Copyright Year | 2011 |
| Description | Author affiliation: Micron Technology 1839 S. Alma School Rd., Ste.310, Mesa, AZ 85210, USA (Myung Jin Yim; Strode, R.; Brand, J.; Adimula, R.; Zhang, J.J.; Chan Yoo) |
| Abstract | Package on Package (PoP) is one of the increasingly used high density package solution for package stacking technology in various device manufacturing applications. Normally PoP configurations use a top package with a stacked memory packaging system connected to a bottom logic packaging system via solder joint. To guarantee the assembly yield and reliability of the solder joint between the top package and bottom package, mechanical compliance between these two packages is crucial during package stacking. The industry is constantly working toward reducing the total stack height and current road maps point toward a thinner total stack Z height of PoP configuration. It is necessary to reduce the package height by reducing the mold cap thickness as well as reduce the mold cap clearance, the distance between the top silicon die to the mold top. However, it is one of the increasing challenges to reduce top package thickness maintaining its low warpage behaviors during the reflow process and to avoid bonding wire exposure after laser mark process due to thin mold cap clearance. In this paper, we used the compression mold process to fabricate PoP top package test vehicle with different mold cap thickness at around 80 um mold cap clearance on 14×14 package size, and investigated the effects of various molding compound materials and substrate material properties on PoP top package warpage behaviors during solder reflow process. The substrates are all 100 um thickness and 2 layer structure. As the mold cap thickness gets thinner, the warpage variation during reflow process gets larger. The material property of key component in top PoP package plays a crucial role in warpage performance. The thermo-mechanical properties of molding compounds after compression molding process and substrate materials are very important and mainly determine the warpage level of the top package at room temperature and the warpage behaviors during the reflow profile for the board level assembly with bottom package. The compression mold compound material properties and substrate core materials were optimized to improve the ultra thin PoP top package. The findings and results provide a guideline of the material selection for warpage control in the PoP top package to improve the PoP assembly yield and reliability. |
| Starting Page | 1141 |
| Ending Page | 1146 |
| File Size | 785443 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898654 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Substrates Compounds Temperature Material properties Temperature measurement Electromagnetic compatibility |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|