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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Rezvani, A. Mayer, M. Shah, A. Zhou, N. Hong, S.J. Moon, J.T. |
| Copyright Year | 2011 |
| Description | Author affiliation: MK Electron Co. Ltd., Yongin, S. Korea (Hong, S.J.; Moon, J.T.) || Microjoining Laboratory, Centre of Advanced Materials Joining, University of Waterloo, Waterloo, Canada (Rezvani, A.; Mayer, M.; Shah, A.; Zhou, N.) |
| Abstract | With 20μm diameter PCC wire, spherical (well-shaped) free-air balls (FABs) were obtained in both forming gas and N2 at flow rates between 0.25–0.75 l/min and 0.4–0.5 l/min, respectively. With Cu wire, in comparison, sperical FAB are obtained in forming gas with flow rates between 0.25 and 0.5 l/min while in N2 gas, FABs are always pointed or golf-clubbed (mis-shaped). Using a shielding gas with Au wire makes the FABs mis-shaped. The FAB deformability is measured as the amount of deformation under a given load. Au had the highest deform-ability. The FABs made with PCC wire in N2 had generally the same deformability as Cu FABs in forming gas. The force required to achieve a pre-defined deformed ball height (target) is named “force for target deformation”, FTD, and set to half the FAB diameter. Compared to "deformability", the FTD method is more similar to the standard tensile or compression tests that determine yield strength. Deforming a PCC FAB obtained with 0.4 1/min N2 to the target ball height requires 615 ± 32 mN, a value not significantly different from that for a Cu FAB obtained in 5 l/min forming gas. For comparison, the target deformation requires 394 ± 16 mN for a Au FAB. |
| Starting Page | 1516 |
| Ending Page | 1522 |
| File Size | 1327906 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898711 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wires Copper Gold Force Manganese Bonding Correlation |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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