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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lu, K.H. Suk-Kyu Ryu Qiu Zhao Hummler, K. Im, J. Rui Huang Ho, P.S. |
| Copyright Year | 2011 |
| Description | Author affiliation: Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, Texas 78712 (Suk-Kyu Ryu; Rui Huang) || Microelectronics Research Center, University of Texas at Austin, Austin, TX 78758 (Lu, K.H.; Qiu Zhao; Im, J.; Ho, P.S.) || Sixis Inc., Research Triangle Park, NC 27709 (Hummler, K.) |
| Abstract | In this paper, temperature-dependent thermal stresses in Cu TSVs are measured by combining the bending beam experiment with a finite element analysis (FEA). The bending beam technique measures the averaged bending curvature induced by the thermal expansion of a periodic annular Cu TSV array. The structural complexity of the blind annular TSV necessitated the use of FEA to derive the TSV-induced thermal stresses which accounts for the beam bending during thermal cycles. The FEA simulations established linear relationships between bending curvature and stress components in TSVs. Such linear relationships were used to extract independent stress components from the bending beam measurements. The results provided an understanding to the temperature-dependent stress characteristics in TSVs. |
| Starting Page | 1475 |
| Ending Page | 1480 |
| File Size | 4556661 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898705 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Stress Copper Silicon Thermal stresses Measurement by laser beam Laser beams Through-silicon vias |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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