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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chaoran Yang Fubin Song Lee, S.W.R. |
| Copyright Year | 2011 |
| Description | Author affiliation: Electronic Packaging Laboratory, Center for Advanced Microsystems Packaging Hong Kong University of Science & Technology (Chaoran Yang; Fubin Song; Lee, S.W.R.) |
| Abstract | The brittle failure mechanism of solder joints has gained more and more attention due to the introduction of lead-free solders and also the extensive use of different kinds of portable electronic products. The excessive growth of the IMC is blamed to increase the propensity of the brittle failure. Typically the thickness of the IMC layer is used to indicate the risk of failure of solder joints. Cu6Sn5 and Cu3Sn are the most common IMCs found in Sn-Ag-Cu (SAC) lead-free solder joints with OSP pad finish. Previous studies revealed that the brittle failure mostly occurred in the IMC region. However, the respective role of Cu6Sn5 and Cu3Sn in the solder joint brittle failure still remains unclear. In the present study, different amounts of Nickel (Ni) were doped in the Sn-Cu based solder. Its effects on the growth rate of (Cu, Ni)6Sn5/Cu6Sn5 and Cu3Sn were characterized at first. Subsequently, the results of characterization were utilized to produce different growth rates of (Cu, Ni)6Sn5 and Cu3Sn under thermal aging. The thicknesses of (Cu, Ni)6Sn5/Cu6Sn5 and Cu3Sn after different aging hours were measured using SEM (with EDX and BSE). High speed ball pull/shear tests were performed. The correlation between IMC strength and IMC layer thicknesses was established. An investigation on the effect of Ni on the micro-hardness of solder is also included in this study. |
| Starting Page | 971 |
| Ending Page | 978 |
| File Size | 4156108 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898627 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Aging Nickel Copper Soldering Scanning electron microscopy Inspection Thickness measurement |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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