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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | MyoungSu Chae Ouyang, E. |
| Copyright Year | 2013 |
| Description | Author affiliation: STATS ChipPAC Ltd., Ichon, South Korea (MyoungSu Chae; Ouyang, E.) |
| Abstract | In this paper we will demonstrate and present an analysis methodology to account for the processing parameters, particularly the manufacturing and processing of mold compound materials, to form flip chip packages on a substrate strip. The impact of manufacturing parameters such as pressure, temperature, shrinkage, and processing timing on strip warpage will all be considered and modeled. The commercial finite element tools are used in the study. The factorial analysis is conducted to determine which parameter is more dominant. Furthermore, a series of experiments are conducted to compare the numerical data. This result shows that the proposed modeling methodology is able to obtain better match of the experiment vs. simulation data than a traditional mechanical analysis. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 441 |
| Ending Page | 448 |
| File Size | 2449443 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575609 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Substrates Temperature Cavity resonators Strips Compounds Finite element analysis |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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