NDLI: Effect of Nickel Pad Metallization Thickness on Fatigue Failure of BGA Lead-Free Solder Joints

Content Provider	IEEE Xplore Digital Library
Author	Omiya, M. Miyazaki, T. Kishimoto, K. Amagai, M.
Copyright Year	1999
Abstract	The purpose of this paper is to present our work on the effect of nickel (Ni) pad metallization thickness on fatigue failure of lead-free solder joints after thermal aging. Cyclic three-point bending tests were carried out to investigate the relationship between intermetallic compound (IMC) layer development and the fatigue life of solder joints. After the fatigue tests, cross-sections of solder joint were observed by scanning electron microscopy (SEM) and crack propagation paths were investigated. The results show that when the thickness of the Ni pad metallization layer was too thin, voids in the solder were observed and the fatigue life of the solder joints was shortened. On the other hand, when the thickness of the Ni pad metallization layer was too thick, thick IMC layers between the solder layer and the Ni layer developed after thermal aging. The optimum thickness of Ni pad metallization layer in this study was either 0.08 or 0.12 mum. For these thicknesses, the Ni layer diffused into the solder and was consumed completely. For these conditions, the development of an IMC layer did not occur during the thermal aging, and good fatigue strengths were obtained.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	734
Ending Page	740
Page Count	7
File Size	1881932
File Format	PDF
ISSN	15213331
Volume Number	31
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nickel Metallization Fatigue Environmentally friendly manufacturing techniques Lead Soldering Aging Scanning electron microscopy Life testing Intermetallic solder joint Ball grid array fatigue intermetallic compound lead-free solder nickel
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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