NDLI: Improving package assembly process yield for complex high density flip chip applications

Content Provider	IEEE Xplore Digital Library
Author	Solberg, V. Oganesian, V.
Copyright Year	2009
Description	Author affiliation: Tessera, 3025 Orchard Parkway, San Jose, California USA, 408-321-6000 (Solberg, V.; Oganesian, V.)
Abstract	The more advanced microprocessor and ASIC semiconductor packaging currently require several thousand I/O contacts and they are expected to expand contact I/O by 30% in the very near future. Consistent die-to-substrate interface, however, remains the most critical barrier in achieving optimum assembly process yield. Semiconductor suppliers have abandoned the traditional wirebond package assembly for many of these higher I/O products, opting for the more compact die face-down flip-chip attachment methodology. This face-down, direct attachment method significantly reduces the semiconductors package size as well as enhancing product performance. While wire-bond interface may remain the preference for many applications, face-down direct chip attachment has gained popularity for the higher-speed processor and ASIC products. There are a number of factors to consider when selecting an optimal semiconductor package configuration for the newer generations of high density controllers and processors; I/O requirement, package footprint, form factor, thermal dissipation, electrical performance, and cost. This paper will describe a new interconnect solution developed to provide a very uniform array of raised solid copper contact features integrated onto the substrate interposer for mounting very fine pitch bumped flip-chip semiconductor die. This unique raised contact substrate enables semiconductor developers to significantly reduce contact pitch on the die without reducing pad size. Solder bumped die are placed directly onto the raised contact features eliminating the need for solder printing on the package substrate. Mounting the bumped die element on this planer topography solves fundamental issues associated with electro-migration and avoids many of the current assembly process related defects. This is because the raised contact features provide a uniform package interconnect that furnishes a consistent standoff height for improving underfill flow control even with low melt solders.
Starting Page	27
Ending Page	30
File Size	702691
Page Count	4
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416579
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Flip chip Semiconductor device packaging Contacts Substrates Application specific integrated circuits Microprocessors Optimal control Process control Thermal factors
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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