NDLI: Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering

Content Provider	IEEE Xplore Digital Library
Author	Bernasko, P.K. Mallik, S. Ekere, N.N. Seman, A. Takyi, G.
Copyright Year	2009
Description	Author affiliation: Electronic Manufacturing Engineering Research Group, Medway School of Engineering, University of Greenwich, Chatham Maritime, Kent ME4 4TB, UK (Bernasko, P.K.; Mallik, S.; Ekere, N.N.; Seman, A.) \|\| Department of Mechanical Engineering, Kwame Nkruma University of Science and Technology, Kumasi Ghana (Takyi, G.)
Abstract	The formation and growth of intermetallic compound layer thickness is one of the important issues in search for reliable electronic and electrical connections. Intermetallic compounds (IMCs) are an essential part of solder joints. At low levels, they have a strengthening effect on the joint; but at higher levels, they tend to make solder joints more brittle. If the solder joint is subjected to long-standing exposure of high temperature, this could result in continuous growth of intermetallic compound layer. The brittle intermetallic compound layer formed in this way is very much prone to fracture and could therefore lead to mechanical and electrical failure of the joint. Therefore, the primary aim of this study is to investigate the growth of intermetallic compound layer thickness subjected to five different reflow profiles. The study also looks at the effect of three different temperature cycles (with maximum cycle temperature of 25 °C, 40 °C and 60 °C) on intermetallic compound formation and their growth behaviour. Two different Sn-Ag-Cu solder pastes (namely paste P1 and paste P2) which were different in flux medium, were used for the study. The result showed that the growth of intermetallic compound layer thickness was a function of ageing temperature. It was found that the rate of growth of intermetallic compound layer thickness of paste P1 was higher than paste P2 at the same temperature condition. This behaviour could be related to the differences in flux mediums of solder paste samples used.
Starting Page	986
Ending Page	990
File Size	539437
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416398
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Intermetallic Environmentally friendly manufacturing techniques Lead Soldering Temperature Copper Electronics industry Electronics packaging Fatigue
Content Type	Text
Resource Type	Article

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