NDLI: Optimizing manufacturing process of printed electronics

Content Provider	IEEE Xplore Digital Library
Author	Salam, B. Gan, H.Y. Lok, B.K. Albert, L.
Copyright Year	2009
Description	Author affiliation: Singapore Institute of Manufacturing Technology, Large Area Processing (LAP) Programme, 71 Nanyang Drive, Singapore - 638075 (Salam, B.; Gan, H.Y.; Lok, B.K.; Albert, L.)
Abstract	Printed electronics generally refers to the creation of electronic functionality, e.g. conducting circuitry, electrical components, by means of conventional printing techniques on common media such as plastics and paper. The main benefit of printed electronics is the simplified fabrication process, because of the elimination of the complex photolithography process. This means lower cost and shorter cycle time. However, several challenges must still be addressed, such as reliability, electrical performance and peripheral interfacing. Hereby peripheral interfacing was addressed, in particular the manufacturing process of the printed interconnects was studied. The study was conducted following the $2^{(7–4)}$ fractional factorial design of experiment (DOE) method. Experimental parameters were curing temperature, curing time, pad thickness, pad sizes, solder alloys, cleaning time and number of reflows. Results of the study include effects of the parameters on shear strength of the printed interconnects and the recommendation of values to best employ.
Starting Page	163
Ending Page	167
File Size	575994
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416556
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manufacturing processes Integrated circuit interconnections Curing Printing Plastics Fabrication Lithography Costs US Department of Energy Temperature manufacturing yields printed interconnects printed copper printed electronics shear strength
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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