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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Agarwal, R. Pham, N. Cotrin, R. Andrei, A. Ruythooren, W. Iker, F. Soussan, P. |
| Copyright Year | 2009 |
| Description | Author affiliation: IMEC, Kapeldreef 75, 3001 Leuven, Belgium (Agarwal, R.; Pham, N.; Cotrin, R.; Andrei, A.; Ruythooren, W.; Iker, F.; Soussan, P.) |
| Abstract | In this paper we report the results of diamond bit cutting on metals, such as Cu and Sn, polymers, temporary glue and polyimide. Diamond bit cutting is an attractive, fast and economically viable option when processing on high topography wafers is required, or when smooth surface finish is required. Diamond bit cutting can planarize the surface of the high topography features on which conventional IC processing steps can be performed with ease. |
| Starting Page | 267 |
| Ending Page | 271 |
| File Size | 1616013 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424450992 |
| e-ISBN | 9781424451005 |
| DOI | 10.1109/EPTC.2009.5416538 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Surface topography Polymers Wafer bonding Tin Rough surfaces Surface roughness Polyimides Stacking Temperature High speed optical techniques |
| Content Type | Text |
| Resource Type | Article |
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