NDLI: Next generation materials for thermal interface and high density energy storage applications via liquid phase sintering

Content Provider	IEEE Xplore Digital Library
Author	Liu, J. Rottman, P. Dutta, S. Kumar, P. Raj, R. Renavikar, M. Dutta, I.
Copyright Year	2009
Description	Author affiliation: School of Mechanical & Materials Engineering, Washington State University, Pullman, WA 99164, U.S.A. (Liu, J.; Rottman, P.; Dutta, S.; Kumar, P.; Dutta, I.) \|\| Assembly Technology Development, INTEL Corp., AZ 85226, U.S.A. (Renavikar, M.) \|\| Dept. of Mechanical Engineering, University of Colorado, Boulder, CO 80309, U.S.A. (Raj, R.)
Abstract	With the continuing increase in power dissipation requirements of electronic devices, there is a need to develop new thermal interface materials (TIM) with much higher thermal conductivity (K) than that available from conventional TIMs. Recently, liquid phase sintering (LPS) has been proposed as a new paradigm for designing next generation composite-solder TIMs with a radically different microstructure from those of conventional solder-TIMs. LPS metallic composites are also attractive as phase change materials (PCM) for thermal energy storage, where the latent heat absorbed by the one of the phases upon melting can be stored for later retrieval and/or conversion to other forms of energy. The principal advantage of metallic PCMs over other materials include: (i) much greater energy storage per unit volume than organic PCMs; and (ii) much higher thermal conductivity than both organics and inorganic salt PCMs, which allow rapid heating and energy capture. This paper presents recent results on the development of metallic TIM and PCMs for energy storage, processed by LPS of a high melting phase (HMP) with a low melting phase (LMP). A discussion of processing issues, resultant properties, and modeling results expounding the benefits of these materials is presented.
Starting Page	506
Ending Page	511
File Size	1555077
Page Count	6
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416494
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Energy storage Phase change materials Thermal conductivity Conducting materials Power dissipation Microstructure Inorganic materials Organic materials Rapid thermal processing Heating
Content Type	Text
Resource Type	Article

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