NDLI: Electrochemical migration study of fine pitch lead free micro bump interconnect

Content Provider	IEEE Xplore Digital Library
Author	Da-Quan Yu Tai Chong Chai Meei Ling Thew Yue Ying Ong
Copyright Year	2009
Description	Author affiliation: Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore, Science Park II, Singapore 117685 (Da-Quan Yu; Tai Chong Chai; Meei Ling Thew; Yue Ying Ong)
Abstract	Elelctrochemical migration (ECM) test was conducted for fine pitch flip-chip micro bump interconnect. Two kinds of micro bump. i. e., Cu post with SnAg solder and Cu under bump metallization (UBM) with SnAg solder bumps in 50 and 100 µm pitch with non clean flux were used for chip interconnection. The test was conducted under 85ºC/85H condition with various biases. The results indicated that for micro bump with underfill, test with different bias and pitch showed that the smaller the pitch, the higher the bias, the easier for insulation resistance (IR) value drop. By top-down grinding, dendrites were detected and the main compositions of the dendrites were Cu and Sn. The ECM tests confirmed that even with underfill, ECM failure is a concern for micro bump interconnects with fine pitch down to 50 µm. The mechanism of the dendrite formation was proposed and it was believed that the adsorption of water steam by underfill materials and the existence of residual flux were the main reasons for the dendrites formation.
Starting Page	389
Ending Page	394
File Size	2036658
Page Count	6
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416517
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Electrochemical machining Testing Electronic countermeasures Lead Conducting materials Electronic packaging thermal management Gold Microelectronics Insulation
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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