NDLI: Development of negative profile of dry film resist for metal lift off process

Content Provider	IEEE Xplore Digital Library
Author	Chew, M. Soon Wee Ho Su, N. Liao, E. Rao, V.S. Premachandran, C.S. Kumar, R. Damaruganath, P.
Copyright Year	2009
Description	Author affiliation: Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research) 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Chew, M.; Soon Wee Ho; Su, N.; Liao, E.; Rao, V.S.; Premachandran, C.S.; Kumar, R.; Damaruganath, P.)
Abstract	A dry film photoresist was selected as the sacrificial material for a metal lift off process. However, a weak and inconsistent adhesion of the evaporated under bump metallurgy (UBM) and solder on the passivation surface was observed during the dry film stripping process. This problem may be due to the poor negative profile (88 to 89 degrees) of the patterned dry film side wall after dry film developing, resulting to inconsistent metal lift off. A few dry film predevelopment and post development parameters are identified and tested from the standard dry film development process, to obtain a negative profile of the dry film to be less than 84 degrees. After each test, cross section of the patterned dry film side wall is observed under a microscope to check if a negative profile is obtained. The 50μm thick dry film at $35mJ/cm^{2}$ with other modifications of the process gives the best results
Starting Page	884
Ending Page	888
File Size	411037
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416418
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Resists Substrates Adhesives Inorganic materials Passivation Testing Costs Microelectronics Materials science and technology Standards development
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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