NDLI: Mold process development of C90 LowK and ultra-finepitch BGA for robust reliability performance

Content Provider	IEEE Xplore Digital Library
Author	Ibrahim, R. Boon-Yew Low Zi-Song Poh
Copyright Year	2009
Description	Author affiliation: Freescale Semiconductor (M) Sdn Bhd, 2, Jalan SS8/2, Free Industrial Zone Sg. Way, 47300 P.Jaya, Selangor, Malaysia (Ibrahim, R.; Boon-Yew Low; Zi-Song Poh)
Abstract	The use of porous material as dielectric for C90 has imposed significant challenge for package encapsulation due to its porous nature which requires extremely low stress condition under thermal excursion. This paper discussed the challenges in defining the critical characteristics in packaging with special emphasis on molding process in order to achieve robust and reliable package. Key challenges in this particular development was imposed by the increase in package body size, the tightening in wirebond pitch, increased in wire count and tiers, and the inclusion of metal heat spreaders. These factors have significant impact on the mold compound flow and the distribution of filler in the molded package which was found to be responsible for delamination and electrical failure. The resolution to the problem focused on the reduction in average filler size and distribution to improve filler and matrix composition across the molded region. The improvement in these areas has enabled the package to surpass 1000 cycles of temperature cycling and met qualification reliability stress requirement.
Starting Page	352
Ending Page	356
File Size	614983
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416522
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Robustness Thermal stresses Electronic packaging thermal management Wire Dielectric materials Thermal expansion Silicon compounds Composite materials Encapsulation Microassembly
Content Type	Text
Resource Type	Article

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