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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Changwoo Lee Jaehak Lee Tae Ho Ha Junyeob Song |
| Copyright Year | 2009 |
| Description | Author affiliation: Dep. of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials, Daejeon, South Korea (Changwoo Lee; Jaehak Lee; Tae Ho Ha; Junyeob Song) |
| Abstract | In this paper, porous vacuum picker and bonding head to impose uniform pressure on all the surface of wafer in the bonding process are proposed newly. Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which induce small vacuum pressure at those holes region. Also, to impose uniform pressure on the wafer under bonding process, bonding head is designed using air piston type with metal ball joint, which automatically compensate for coplanarity problem of bonding pad. FEM analysis and experiments are conducted to evaluate the performance of porous vacuum picker and bonding head of air piston type. |
| Starting Page | 220 |
| Ending Page | 224 |
| File Size | 4041951 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424450992 |
| e-ISBN | 9781424451005 |
| DOI | 10.1109/EPTC.2009.5416546 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wafer bonding Vacuum technology Magnetic heads Machining Bonding processes Pistons Packaging Fabrication Machinery Vacuum systems |
| Content Type | Text |
| Resource Type | Article |
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