NDLI: Optimization of flexible substrate for automotive LED rear-lamp

Content Provider	IEEE Xplore Digital Library
Author	Young-Woo Kim Min-Sung Kim Sung-Mo Park Jae-Pil Kim Sang-Bin Song Nam Whang Yeong-Seog Lim
Copyright Year	2009
Description	Author affiliation: Solid State Lighting Team, Korea Photonics Technology Institute, 971-35 Wolchul-dong, Buk-ku, Gwangju 500-779, Korea (Young-Woo Kim; Min-Sung Kim; Sung-Mo Park; Jae-Pil Kim; Sang-Bin Song; Nam Whang) \|\| Division of Electronics and Computer Engineering, Chonnam National University, 300 Yongbong-dong, Buk-gu, Gwangju, 500-757, Korea (Yeong-Seog Lim)
Abstract	High brightness light-emitting diodes (HB LEDs) for the automotive exterior lighting system are required to maintain the stable light output irrespective of the ambient temperature. We design the flexible substrate with the thick trace layer for heat spreader for the conventional process of printed circuit board (PCB). The performance of flexible PCB substrate with the thick copper layer of 200 um is compared with the conventional substrate attached on aluminum heat spreader of 1.5 mm and 150 W/m-K. The proposed design is analyzed in accordance with the size and thickness of heat spreader, and then the heat emission properties of the proposed substrate laminated with thick copper foil is characterized by using CFD (computational fluid dynamics) technology. The optimization of the substrate is carried out in accordance with the forward current and voltage. The thermal resistance from the top surface of LED to the plastic housing can be decreased over 1.5 times in comparison with the conventional structure while the delta forward voltage is controlled within 0. 04 V.
Starting Page	926
Ending Page	929
File Size	525146
Page Count	4
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416410
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Automotive engineering Light emitting diodes Copper Computational fluid dynamics Thermal resistance Surface resistance Brightness LED lamps Temperature Flexible printed circuits
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in