NDLI: Thermal resistance (Rth) enhancement by optimizing to package thermal contact

Content Provider	IEEE Xplore Digital Library
Author	Lee Teck Sim Darakorn, S.L.
Copyright Year	2009
Description	Author affiliation: Infineon Technologies (Malaysia) Sdn Bhd, Free Trade Zone, Batu Berendam, 75350 Malacca., P.O. Box 52, 75710 Malacca (Lee Teck Sim; Darakorn, S.L.) The trend for package size shrinkage has created challenges to thermal performance while improving the cost performance. When TO package size shrink by minimizing the leadframe copper usage, challenges in package warpage and thermal contact become great. TO High Creepage (a shrink version of new generation TO247) introduced difference copper thicknesses at die pad and heatsink for better material cost has created difference warpage profile which resulted loosing of the thermal contact area. The optimization of mold compound CTE for minimizing the mismatch with copper leadframe did not demonstrate positively on warpage reduction. The loss of thermal contact area and increase of thermal resistance due to warpage were characterized to determine the most effective approach to enlarge the thermal contact area. The new approach is to design-in an appropriate feature on the package to optimize the thermal contact area. The pre-shaping of package mold body as a design-in feature for compensating the loss of thermal contact area has been introduced. By this design-in feature, the package thermal contact area has been optimized and therefore the thermal performance is enhanced to the acceptable level.
Starting Page	646
Ending Page	651
File Size	2555765
Page Count	6
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416471
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Contact resistance Semiconductor device packaging Electronic packaging thermal management Costs Copper Design optimization Heat sinks Fasteners Resistance heating
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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