NDLI: High density indium bumping using electrodeposition enhanced by megasonic agitation

Content Provider	IEEE Xplore Digital Library
Author	Yingtao Tian Changqing Liu Hutt, D. Stevens, B. Flynn, D. Desmulliez, M.P.Y.
Copyright Year	2009
Description	Author affiliation: MIcroSystems Engineering Centre (MISEC), School of Engineering & Physical Sciences, Earl Mountbatten Building, Heriot-Watt University, Edinburgh EH14 4AS, Scotland, UK (Flynn, D.; Desmulliez, M.P.Y.) \|\| Central Microstructure Facility, Rutherford Appleton Laboratory, Chilton, Didcot, Oxfordshire OX11 0QX, UK (Stevens, B.) \|\| Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire, LE11 3TU, UK (Yingtao Tian; Changqing Liu; Hutt, D.)
Abstract	Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 μm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study.
Starting Page	31
Ending Page	35
File Size	2277199
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416576
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Indium Microstructure Current density Frequency Maintenance engineering Bonding Production Manufacturing processes Laboratories Fabrication
Content Type	Text
Resource Type	Article

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