NDLI: Low temperature dielectric material for embedded micro wafer level packaging

Content Provider	IEEE Xplore Digital Library
Author	Su, N. Rao, V.S. Ho Soon Wee Sharma, G. Lim Ying Ying Kumar, A. Damaruganath, P.
Copyright Year	2009
Description	Author affiliation: Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore 117685 (Su, N.; Rao, V.S.; Ho Soon Wee; Sharma, G.; Lim Ying Ying; Kumar, A.; Damaruganath, P.)
Abstract	In this paper, we have developed the evaluation results of low cure temperature (less than 200 deg C) dielectric materials in terms of process ability and adhesion on SiN and mold compound substrates. The results showed that the low cure temperature dielectric materials have good adhesion on SiN and mold compound substrate. Integration of thin film passives like inductors, capacitors and band pass filters are also demonstrated on this mold compound wafer platform using electroplated Cu and low cure temperature dielectric material. Developed thin film passives on mold compound wafer platform have significantly improved the passives performances that are benchmarked against high resistivity silicon wafer (HiRSi). Reliability test vehicles are fabricated using Cu RDL, low cure temperature dielectric material and electroplated Cu UBM with SAC solder bump interconnects. A complete description of dielectric material evaluation for EMWLP, process development of thin film passive fabrication and multi-layer RDL integration on reconstructed mold compound wafer has been discussed.
Starting Page	197
Ending Page	201
File Size	1435856
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416550
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Dielectric materials Wafer scale integration Dielectric thin films Adhesives Silicon compounds Dielectric substrates Thin film inductors Capacitors Band pass filters
Content Type	Text
Resource Type	Article

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