NDLI: Ultra thinning of wafer for embedded wafer packaging

Content Provider	IEEE Xplore Digital Library
Author	Lee Wen Sheng Khan, N. Kek, J. Chua, H.S. Tsutsumi, Y. Yew, L.C. Ho Soon Wee Eipa, M. Vempati, S. Kripesh, V. Sundaram, V.
Copyright Year	2009
Description	Author affiliation: Georgia Institute Of Technology, Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore, Science Park II, Singapore 117685 (Lee Wen Sheng; Yew, L.C.; Ho Soon Wee; Eipa, M.; Vempati, S.; Kripesh, V.) \|\| Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore, Science Park II, Singapore 117685 (Khan, N.; Kek, J.; Chua, H.S.; Tsutsumi, Y.)
Abstract	Wafer thinning has been an important topic in the semiconductor industry. The trend in microelectronic industry is getting thinner and smaller packages. During the process of wafer thinning and sawing, die cracks and thus leading to failures. This problem becomes more significant, when the chip thickness becomes less than 50µm. In this paper, wafer thinning parameters and its effect on the die strength has been reported. A design of experiment (DOE) has been designed to systematically analyze the wafer thinning processes. Established processes for ultra wafer thinning of 40um thickness and die strength characterization results were given in this paper. The wafer sub-surface damages after grinding and stress relieving processed have been reported.
Starting Page	909
Ending Page	914
File Size	2905589
Page Count	6
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416415
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Feeds Roentgenium Electronics packaging Testing Microelectronics Electronics industry Semiconductor device packaging Stress Substrates Rough surfaces
Content Type	Text
Resource Type	Article

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