NDLI: Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking

Content Provider	IEEE Xplore Digital Library
Author	Chee Houe Khong Aibin Yu Xiaowu Zhang Kripesh, V. Pinjala, D. Dim-Lee Kwong Chen, S. Chien-Feng Chan Chun-Chieh Chao Chi-Hsin Chiu Chih-Ming Huang Carl Chen
Copyright Year	2009
Description	Author affiliation: Siliconware Precision Industries Co., Ltd. No. 153, Sec. 3, Chung-Shan Rd. Tantzu Taichung 427, Taiwan, R.O.C. (Chen, S.; Chien-Feng Chan; Chun-Chieh Chao; Chi-Hsin Chiu; Chih-Ming Huang; Carl Chen) \|\| Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore, Science Park II, Singapore 117685 (Chee Houe Khong; Aibin Yu; Xiaowu Zhang; Kripesh, V.; Pinjala, D.; Dim-Lee Kwong)
Abstract	The submodeling technique is a powerful analysis tool. The method promotes more accurate analysis and also helps enhance productivity. It has been shown that by using displacement-force cut boundary condition method, it can be made even more versatile. The local stress phenomena of the solder microbump have been solved with this approach to demonstrate the concept. From the simulation model, it is known that the ENIG pad thickness has an effect on the aluminium pad stress in the silicon chip. This is important as the shear stress will damage the pad and circuitry on the chip. Previously this is not reported in other literatures as there is no strain gage available that can measure such a small dimension.
Starting Page	591
Ending Page	595
File Size	999220
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416481
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Assembly Stacking Strain measurement Productivity Boundary conditions Thermal stresses Circuit simulation Aluminum Silicon
Content Type	Text
Resource Type	Article

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