NDLI: How to fabricate specimens for silicon-to-molding compound interface adhesion measurements

Content Provider	IEEE Xplore Digital Library
Author	Schlottig, G. Pape, H. An Xiao Wunderle, B. Ernst, L.
Copyright Year	2009
Description	Author affiliation: Delft University of Technology, 2628 CD Delft, The Netherlands (An Xiao; Ernst, L.) \|\| Infineon Technologies AG, 81726 Munich, Germany (Schlottig, G.; Pape, H.) \|\| Fraunhofer IZM, 13355 Berlin, Germany (Wunderle, B.)
Abstract	We present a new method to fabricate specimen for interfacial fracture testing. It regards the interface between silicon die and epoxy molding compound (EMC). The crucial element of evaluating interfacial fracture strength is the calculation of critical fracture values. Such values can be obtained analyzing a bimaterial type of sample and by specifically inducing a delamination while monitoring conditions and loads. We use a sandwich type of sample where the epoxy molding compound encloses the silicon die. We give a detailed description of molding specimens using an established transfer molding process that has a sufficiently large cavity available. In order to prevent breakage and related residual stresses we use specific bearings to hold the silicon stripes symmetrically in place. The bearings are made out of cured EMC themselves. The samples did not break and allow for interfacial fracture characterization. For testing the specimens we used the Mixed Mode Chisel (MMC) setup, which is one of the first to at all induce and monitor delamination of the Si-EMC interface.
Starting Page	357
Ending Page	362
File Size	1818936
Page Count	6
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416523
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Silicon Electromagnetic compatibility Geometry Testing Delamination Fabrication Clamps Chemical technology Residual stresses
Content Type	Text
Resource Type	Article

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