NDLI: Development of high speed board level bend tester for drop impact applications

Content Provider	IEEE Xplore Digital Library
Author	Shu Min Lim Zhong Chen Hun Shen Ng Tong Yan Tee Choong Peng Khoo Chng, V. Fu Lin Liu Kuo Tsing Tsai
Copyright Year	2009
Description	Author affiliation: Amkor Technology. 2 Science Park Drive, Singapore 118222 (Hun Shen Ng; Tong Yan Tee; Choong Peng Khoo) \|\| Instron Singapore Pte Ltd. 16A Science Park Drive #02-04, Singapore 118228 (Chng, V.; Fu Lin Liu; Kuo Tsing Tsai) \|\| School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Shu Min Lim; Zhong Chen)
Abstract	Due to the widespread use of portable electronics, there is a significant increase in interest in exploring the impact reliability of electronic packaging during impact shock. Currently, the test standard used for board level drop testing is JESD 22-B111 [1], which specifies the impact pulse (i.e. 1500G at 0.5ms) as a criterion for drop testing. However, this may not mimic the actual product testing. The board level cyclic bend test standard (JESD 22-B113) [2] is subsequently developed and introduced to perform low frequency bending (1 to 3 Hz). However, cyclic bend at low frequency is not able to produce similar failure mode as drop testing because board frequency during drop impact is usually much higher. Thus in this study, a high speed bend test (>50Hz) is developed to perform strain-controlled bend testing. The strain amplitude and frequency effects on BGA and WLCSP package solder joint life on various board sizes and component layout are studied and discussed. An increase in frequency was found to result in a significant reduction in time to failure, though a shift in failure mode (from bulk solder to inter-metallic failure) and reduction in cycles to failure were not observed. Results indicated that at higher strain amplitudes, cycles to fatigue life of package significantly decreased. This study has also shown a certain extent of correlation between drop test and high speed bend test.
Starting Page	244
Ending Page	248
File Size	466807
Page Count	5
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416542
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitive sensors Frequency Life testing Packaging Materials testing Materials science and technology Stress Performance evaluation Circuit testing Fixtures
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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