NDLI: A novel approach to die attach: Magnetic rollers with substrate thickness detection capability

Content Provider	IEEE Xplore Digital Library
Author	Vittal, R. Vemal, R.
Copyright Year	2009
Description	Author affiliation: Freescale Semiconductors (M) Sdn Bhd, 2, Jln SS8/2, FTZ Sg Way, 47300 P.J. Selangor (Vittal, R.; Vemal, R.)
Abstract	IC Manufacturing has become a critical operation with increasing requests for zero defective ppm, and the core front end processes such as wire bonding and die attach remain the main focus when a new material is introduced. Die attach in particular holds importance as it is the very basis of creating support for the die and subsequent connections which need to be made. However, in high volume manufacturing, there are many packages which need to be processed on a single die attach module, and conversions are necessary. These conversions are necessary for different substrate sizes and package types. Due to the design of the current die attach substrate rollers, there is much manual handling in tightening and positioning the rollers on the substrate. Some of the problems that have cropped up in the past include die attach epoxy on wire bond lead (due to poor roller tightening), substrate mask crack (excessive force from the rollers) and gradual wear and tear of the roller screws. This paper introduces a novel concept which does not require conversions between package types, and eliminates the opportunity for error. This concept will take into consideration the thickness of the substrate using magnetic substrate rollers which have sensors in them for thickness detection which will help improve the die placement accuracy. Two MAPBGA packages will be used to explain this concept and how it works thereof.
Starting Page	746
Ending Page	749
File Size	515523
Page Count	4
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416450
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Packaging Manufacturing processes Wire Magnetic cores Magnetic materials Bonding forces Force sensors Fasteners Magnetic sensors
Content Type	Text
Resource Type	Article

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