NDLI: Versatility and flexibility from low outgassing silicones

Content Provider	IEEE Xplore Digital Library
Author	Riegler, B. Velderrain, M. Lim, T.Y.
Copyright Year	2009
Description	Author affiliation: Sim Yee Engineering Resources, 33 Lorong Markisah 12A, Taman Markisah, Bukit, Mertajam, 14000 Penang, Malaysia (Lim, T.Y.) \|\| NuSil Technology LLC, 33 Lorong Markisah 12A, Taman Markisah, Bukit, Mertajam, 14000 Penang, Malaysia (Riegler, B.; Velderrain, M.)
Abstract	Silicone materials have unique characteristics allowing use in a broad range of applications and preservation of mechanical properties when exposed to extreme conditions. These mechanical properties absorb stresses incurred during thermal cycling as well as remain stable at temperatures up to 300°C for short intervals. The aerospace industry has utilized silicone adhesives and coatings for over fifty years because of these unique properties. Miniaturization of electronic packages has led to using thinner and more fragile materials. This, in combination with the use of lead-free solder with solder reflow temperatures up to 260°C, can cause high shear stress during heating and cooling that can damage a device. Subsequently, there is growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications. A major concern surrounding use of silicones is the volatile component observed to outgas when silicones are exposed to high temperatures and low pressures (vacuum) for extended periods of time. These volatile components may contaminate sensitive surrounding surfaces and equipment making adhesion or soldering difficult in an upstream process. In extreme cases, such as in Micro Electro Mechanical Systems (MEMS) devices, volatiles can cause catastrophic failures with the device operation itself. Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper. Print out these instructions before pasting your paper's text into this document, so you can refer back to it. Re-name it with your Abstract number (if you know it): “p174.doc” is Abstract 174. If you have multiple files, they can have a suffix: “p174c.doc”.
Starting Page	982
Ending Page	985
File Size	1130079
Page Count	4
File Format	PDF
ISBN	9781424450992
e-ISBN	9781424451005
DOI	10.1109/EPTC.2009.5416401
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aerospace materials Mechanical factors Thermal stresses Electronic packaging thermal management Temperature Aerospace industry Coatings Environmentally friendly manufacturing techniques Lead Heating
Content Type	Text
Resource Type	Article

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