NDLI: Failure mode evolution of WLCSP on board by dynamic bend method

Content Provider	IEEE Xplore Digital Library
Author	Chi-Ko Yu Chang, G. Shao, T. Chen, C. Lee, J. Jenn-Ming Song Yao-Ren Liu Mon-Chin Tsai
Copyright Year	2009
Description	Author affiliation: Department of Electronics Engineering, National Kaohsiung University of Applied Sciences, 80778, Taiwan, R.O.C. (Mon-Chin Tsai) \|\| Department of Materials Science and Engineering, National Dong Hwa University, 974 Hualien, Taiwan, R.O.C (Jenn-Ming Song; Yao-Ren Liu) \|\| IST-Integrated Service Technology, 19, Pu-Ding Rd., Hsin-chu 30072, Taiwan, R.O.C (Chi-Ko Yu; Chang, G.; Shao, T.; Chen, C.; Lee, J.)
Abstract	A strain-controllable dynamic bending method on WLCSP has been proposed in this paper. In order to identify the principle factor among the effects of stiffness attributed by different board level structures, the 0.4mm pitch WLCSP packages with Sn-4.0Ag-0.5Cu solder ball are used. This combination of WLCSP is considered to have the high stiffness in the structure. It is also shown that there are interactions between the SAC405 solder balls, the Al/Ni/Cu pad plating, the reflow profile and the flux chemistry. The experimental result shows that at the same strain rate range $(∼10^{6}$ µɛ/s), the fracture position occurrence happens in internal die at 11,000µɛ. This data indicates that the brittle fracture position transfers from general IMC layer to higher brittle layer in the component. The variation of the strain energy of materials and the stress concentration position which changes in different package sizes are speculated to be the cause of the fracture position transfer. Therefore, in our research; we will investigate the relationship between the IMC layer and microstructure of under bump metallization (UBM). The influence of different package dimensions will be discussed in this study, too.
Starting Page	533
Ending Page	536
File Size	1310223
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382237
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	High Strain-rate Bend Test Materials testing Environmentally friendly manufacturing techniques Electronic equipment testing Life testing WLCSP Capacitive sensors Wafer scale integration Circuit testing Packaging Lead Stiffness Assembly
Content Type	Text
Resource Type	Article

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