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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Prasad, A. Teck Gyu Kang Yuan Li Robinson, D. Pasia, R. Bosun Yoo |
| Copyright Year | 2010 |
| Description | Author affiliation: Amkor Technology (Robinson, D.; Pasia, R.; Bosun Yoo) || Altera Corporation, 101 innovation drive, San Jose, CA (Prasad, A.; Teck Gyu Kang; Yuan Li) |
| Abstract | Current portable electronic products are driving component packaging towards Flip Chip Packaging Technologies for integrating multiple electrical functionalities. The driver for flip chip continues to be performance and small form factor. This paper evaluates the lidless and molded flip chip packages with 40nm ultra low K (ULK) Silicon Technology. A comparative study on the two package types is carried out showing the effect of substrate core thickness and die thickness on the package coplanarity. Second level solder fatigue life between the two packages are also discussed. Finite Element Method (FEM) is done using various packaging design parameters and material properties for two packages types to study their effect on the key output parameters like stress in ULK Silicon, component and board level reliability. |
| Starting Page | 31 |
| Ending Page | 35 |
| File Size | 832022 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424464104 |
| ISSN | 05695503 |
| e-ISBN | 9781424464128 |
| e-ISBN | 9781424464111 |
| DOI | 10.1109/ECTC.2010.5490881 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Flip chip Silicon Costs Electronics packaging Application software Consumer electronics Microcomputers Cellular phones Thermal management Electronic packaging thermal management |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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