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Content Provider | IEEE Xplore Digital Library |
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Author | Muralidharan, G. Kurumaddali, K. Kercher, A.K. Leslie, S.G. |
Copyright Year | 2010 |
Description | Author affiliation: Oak Ridge National Laboratory, Bldg. 4508, MS-6083, 1 Bethel Valley Road, Oak Ridge, Tennessee-37831 (Muralidharan, G.; Kurumaddali, K.; Kercher, A.K.) || Powerex Inc, 173 Pavilion Lane, Youngwood, PA 15697 (Leslie, S.G.) |
Abstract | There is a significant need for next-generation, highperformance power electronic packages and systems with wide band gap devices that operate at high temperatures in automotive and electric grid applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200°C. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders. The results of a study on the damage evolution occurring in large area Sn-3.5Ag solder joints between silicon dies and Direct Bonded Copper (DBC) substrates subject to thermal cycling between 200°C and 5°C is presented in this paper. Damage accumulation was followed using high resolution X-ray radiography techniques, and nonlinear finite element models were developed based on the mechanical property data available in literature to understand the relationship between the stress state within the solder joint and the damage occurring under thermal cycling conditions. It was observed that regions of damage observed in the experiments do not correspond to the finite element predictions of the location of regions of maximum plastic work. |
Starting Page | 1823 |
Ending Page | 1829 |
File Size | 1734147 |
Page Count | 7 |
File Format | |
ISBN | 9781424464104 |
ISSN | 05695503 |
e-ISBN | 9781424464128 |
e-ISBN | 9781424464111 |
DOI | 10.1109/ECTC.2010.5490717 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2010-06-01 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Soldering Temperature Electronic packaging thermal management Power system reliability Finite element methods Thermal stresses Electronics packaging Power electronics Wideband Automotive engineering |
Content Type | Text |
Resource Type | Article |
Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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