NDLI: Deconstructing the myth of percolation in electrically conductive adhesives and its implications

Content Provider	IEEE Xplore Digital Library
Author	Agar, J.C. Lin, K.J. Rongwei Zhang Durden, J. Lawrence, K. Kyoung-Sik Moon Wong, C.P.
Copyright Year	2010
Description	Author affiliation: Georgia Institute of Technology, Department of Materials Science and Engineering, 771 Ferst Drive, Atlanta, GA 30332 (Agar, J.C.; Lin, K.J.; Rongwei Zhang; Durden, J.; Lawrence, K.; Kyoung-Sik Moon; Wong, C.P.)
Abstract	The modern emphasis on green technologies has caused the electronics industry to seek alternative solutions to lead-based interconnections. Electrically conductive adhesive (ECAs) composed of metallic fillers within a polymer matrix have received the majority of the interest in lead-free interconnect technology. However, ECAs are still unable to meet the demands of high performance consumer electronics. Previous research recognized a critical filler concentration where there is a dramatic increase in conductivity, followed by a plateau. Researchers have labeled this transition as evidence of a percolation, implying a continuous interconnected metallic network. Our work comprised of a series of "proof of concept" type experiments deconstructs the myth of percolation and emphasize the functional role of the polymer matrix. From a theoretical standpoint direct metal to metal contact is not feasible since silver particles coated with short chain acids are easily wet by the polymer matrix. Assembly conducted under low mechanical stresses is unable to displace the adsorbed surfactant to form metallic contact. Moreover, preparation of a high K epoxy (Dielectric Constant ~5.5), Co(III) acetylacetonates (Co(III) AcAcs) doped diglycidyl ether of bisphenol F had unstable conductivities orders of magnitude lower than the control samples; under similar applied DC. Dielectric constant has a minimal effect if metal to metal contact is the dominant charge transport mechanism. However, tunneling through materials with high dielectric constant impedes the tunneling efficiency. We clearly demonstrate that charge transport at the interface occurs via secondary conductivity pathways, dominated by thermally assisted tunneling mechanisms. The importance of these secondary conductivity mechanisms is highly dependent on the particle-thin film dielectric interaction. This revolutionary discovery provides a new approach for scientists and engineers to improve the performance of electrically conductive adhesives through the incorporation of electrically functional matrix materials.
Starting Page	1713
Ending Page	1718
File Size	744506
Page Count	6
File Format	PDF
ISBN	9781424464104
ISSN	05695503
e-ISBN	9781424464128
e-ISBN	9781424464111
DOI	10.1109/ECTC.2010.5490742
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conductive adhesives High-K gate dielectrics Tunneling Environmentally friendly manufacturing techniques Polymers Conducting materials Dielectric materials Thermal conductivity Electronics industry Consumer electronics
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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