NDLI: In-situ characterization of 3D package systems with on-chip measurements

Content Provider	IEEE Xplore Digital Library
Author	Oh, D. Hai Lan Madden, C. Sam Chang Ling Yang Schmitt, R.
Copyright Year	2010
Description	Author affiliation: Rambus Inc., 4440 El Camino Real, Los Altos, CA 94022 USA (Oh, D.; Hai Lan; Madden, C.; Sam Chang; Ling Yang; Schmitt, R.)
Abstract	Characterization of I/O channels in 3D package systems is quite challenging as it is difficult to observe signal quality. A traditional way of measuring each device in a component level does not capture complex interaction in 3D integration. Although a sense line can be designed to externally measure noise on power lines, it is not feasible for signal lines as it significantly alters the signal quality. Hence, on-chip measurement features are highly desirable for 3D package systems including emerging Through-Silicon Vias (TSV) technology. In this paper, four key on-chip measurement concepts and circuitries are reviewed: eScope for measuring overall link margins, eWave for capturing a signal waveform, nScope for generating and monitoring on-chip power noise, and zScope for measuring power distribution network (PDN). These circuitries are implemented in a low power differential memory interface. The test vehicle is built based on Package-on-Package (PoP) environment. Measurements from the test vehicle are compared with the predicted data based on simulation.
Starting Page	1485
Ending Page	1492
File Size	4455217
Page Count	8
File Format	PDF
ISBN	9781424464104
ISSN	05695503
e-ISBN	9781424464128
e-ISBN	9781424464111
DOI	10.1109/ECTC.2010.5490798
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging System-on-a-chip Power measurement Noise measurement Integrated circuit measurements Circuit noise Through-silicon vias Network-on-a-chip Circuit testing Vehicles
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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