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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yan Liu Fiacco, P. Ning-Cheng Lee |
| Copyright Year | 2010 |
| Description | Author affiliation: Indium Corporation, Clinton, NY (Yan Liu; Fiacco, P.; Ning-Cheng Lee) |
| Abstract | Head-in-pillow (HIP) is ailing the electronic industry when assembling BGAs or CSPs onto PCBs. It is caused by warpage of components or boards at reflow process, and is aggravated by oxidation. Methods for assessing the potential for occurrence of HIP are highly desired by the industry. Besides using BGA rework station followed by tedious dye and pry treatment, two other simpler methods are introduced in this work, Tiny Dot Paste method and Ball Onto Paste method. Tiny Dot Paste method stressed on the assessment of oxidation barrier capability of solder paste, while Ball Onto Paste method assesses combined capability of oxidation resistance and excessive fluxing capacity. Both methods are quick, easy, and close simulation, with the latter being better in real process simulation. Prevention of HIP can be accomplished by (1) designing packages without warpage, (2) printing more paste, (3) dipping solder paste or flux, (4) using inert reflow atmosphere, (5) reducing reflow temperature, (6) placing heat shield on BGA or CSP, (7) avoiding using water soluble solder paste for BGA bumped with no-clean process, (8) using solder bumps or solder powder with oxidation resistant alloy, (9) using fluxes with high oxidation barrier capability and high fluxing capacity. Among all options listed above, using solder paste with high oxidation barrier capability and high fluxing capacity is considered the most easily implemented approaches. |
| Starting Page | 451 |
| Ending Page | 455 |
| File Size | 668044 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424464104 |
| ISSN | 05695503 |
| e-ISBN | 9781424464128 |
| e-ISBN | 9781424464111 |
| DOI | 10.1109/ECTC.2010.5490931 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Testing Oxidation Hip Atmospheric modeling Electronics industry Assembly Packaging Printing Atmosphere Temperature CSP Head-in-pillow solder soldering reflow SMT solder paste BGA |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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