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Content Provider | IEEE Xplore Digital Library |
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Author | Lei Fu Su, M. Anand, A. Goh, E. Kuechenmeister, F. |
Copyright Year | 2010 |
Description | Author affiliation: Globalfounderies, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany (Kuechenmeister, F.) || Advanced Micro Devices Inc., 5204 E Ben White Blvd, Austin, TX 78741, USA (Lei Fu; Su, M.; Anand, A.; Goh, E.) |
Abstract | The introduction of low-k/ultra-low-k (ULK) dielectric materials to accommodate the continuous scaling-down of the feature sizes of IC chips to improve the device density and performance of the ultra-large scale integrated (ULSI) circuits represents great silicon and packaging integration challenges due to the weak mechanical properties of interlayer dielectric material (ILD). Implementation of crackstop and improve low-k/ULK mechanical properties are very effective to protect ILD crack propagation and delamination. Finite element analysis (FEA) simulation and Shadow Moire measurements showed higher die stress with lead free bumps. Reflow simulated Shadow Moire measurements show a large warpage change from 150°C to 25°C, good control of the ramp rate is needed. Die warpage releases 50% after 30 days. |
Starting Page | 1613 |
Ending Page | 1617 |
File Size | 806049 |
Page Count | 5 |
File Format | |
ISBN | 9781424464104 |
ISSN | 05695503 |
e-ISBN | 9781424464128 |
e-ISBN | 9781424464111 |
DOI | 10.1109/ECTC.2010.5490771 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2010-06-01 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Packaging Environmentally friendly manufacturing techniques Dielectric materials Mechanical factors Dielectric measurements Integrated circuit reliability Integrated circuit interconnections Integrated circuit technology Ultra large scale integration Silicon |
Content Type | Text |
Resource Type | Article |
Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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