NDLI: High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Content Provider	IEEE Xplore Digital Library
Author	Reed, J.D. Lueck, M. Gregory, C. Huffman, A. Lannon, J.M. Temple, D.
Copyright Year	2010
Description	Author affiliation: Center for Materials and Electronic Technologies, RTI International Research Triangle Park, NC 27709 USA (Reed, J.D.; Lueck, M.; Gregory, C.; Huffman, A.; Lannon, J.M.; Temple, D.)
Abstract	The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10µm and 15µm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a mechanical key was found to improve yield. A run of 23 consecutive bond pairs was made with mechanical key, resulting in 92% aggregate channel yield at 10µm pitch in area arrays containing 325,632 individual bonds per die to achieve an interconnect density of $10^{6}$ / $cm^{2}.$ SEM cross sections of Cu/Sn-Cu and Cu-Cu bonded samples and EDS analysis of Cu/Sn intermetallic compounds both before and after stress testing are presented. The effects of thermal cycling on electrical yield and resistance are presented for Cu/Sn-Cu with underfill. Comparison of the electrical and shear test performance of Cu/Sn-Cu and Cu-Cu is made.
Starting Page	846
Ending Page	852
File Size	1656924
Page Count	7
File Format	PDF
ISBN	9781424464104
ISSN	05695503
e-ISBN	9781424464128
e-ISBN	9781424464111
DOI	10.1109/ECTC.2010.5490704
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Tin Testing Wafer bonding Vehicles Sensor arrays Thermal stresses Thermal resistance Fabrication Lithography
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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