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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Khan, N. Wee, D.H.S. Ong Siong Chiew Sharmani, C. Li Shiah Lim Hong Yu Li Vasarala, S. |
| Copyright Year | 2010 |
| Description | Author affiliation: Institute of Microelectronics, A¿STAR (Agency for Science, Technology and Research), 11, Science Park Road, Science Park II, Singapore, 117685 (Khan, N.; Wee, D.H.S.; Ong Siong Chiew; Sharmani, C.; Li Shiah Lim; Hong Yu Li; Vasarala, S.) |
| Abstract | Miniaturized 3D package with shorter distances between chips are needed for the mobile and high frequency applications. Chip-to-chip stacking for 3D packaging using conventional assembly method and single step reflow attachment is the most cost-effective. But fine pitch microjoints of stacked chip by single re-flow attachment is challenging due to chip movement during stacking processes, which lead to poor assembly yields. This paper reports a method of stacking chips by thermal tacking and permanent joints are formed simultaneously by single re-flow step. Three chips of 12mm × 12mm size with micro bumps at 100um pitch have been assembled using this approach. Low volume of lead free solder (Sn) has been chosen for the micro-bump interconnections between the chips. The thermal tacking conditions and flip-chip assembly process have been studied in details. The micro-joints quality and reliability have been assessed and reported. |
| Starting Page | 884 |
| Ending Page | 888 |
| File Size | 824565 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424464104 |
| ISSN | 05695503 |
| e-ISBN | 9781424464128 |
| e-ISBN | 9781424464111 |
| DOI | 10.1109/ECTC.2010.5490686 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Stacking Packaging Assembly Testing Wafer bonding Lead Frequency Tin Throughput Microelectronics |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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