NDLI: Adhesion issues in flip-chip on organic modules

Content Provider	IEEE Xplore Digital Library
Author	Tran, S.K. Questad, D.L. Sammakia, B.G.
Copyright Year	1999
Abstract	Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder. Mechanical coupling of the chip and the laminate is done via underfill encapsulant materials. As the chip size increases, the thermal mismatch between silicon and its organic carrier becomes greater. Adhesion becomes an important factor since the C4 joints fail quickly if delamination of the underfill from either chip or the solder mask interface occurs. Newly developed underfills have been studied to examine their properties, including interfacial adhesion strength, flow characteristics, void formation and cure kinetics. This paper will describe basic investigations into the properties of these underfills and also how these properties related to the overall development process. In addition, experiments were performed to determine the effects on adhesion degradation of flip chip assembly processes and materials such as IR reflow profile, flux quantity and residues. Surface treatment of both the chip and the laminate prior to encapsulation were studied to enhance underfill adhesion. Accelerated thermal cycling and highly accelerated stress testing (HAST) were conducted to compare various underfill properties and reliability responses.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	519
Ending Page	524
Page Count	6
File Size	148519
File Format	PDF
ISSN	15213331
Volume Number	22
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Flip chip Laminates Assembly Life estimation Thermal stresses Electronics packaging Electronic packaging thermal management Silicon Delamination
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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