NDLI: Adhesion improvement for polymer dielectric to electrolytic-plated copper

Content Provider	IEEE Xplore Digital Library
Author	Yangyang Sun Xiao Li Gandhi, J. Luo, S. Jiang, T.
Copyright Year	2010
Description	Author affiliation: Assembly R&D, Micron Technology, 8000 S Federal Way, Boise, ID 83707 (Yangyang Sun; Xiao Li; Gandhi, J.; Luo, S.; Jiang, T.)
Abstract	Copper is one of the common metals used in the semiconductor backend process and wafer level packaging. A photo definable polymer layer is usually used to passivate the Cu metal. Acceptable adhesion between the polymer layer and Cu is a very important factor to achieve high reliability for the IC component. The purpose of this paper is to investigate how to improve the adhesion strength between spin-on polymer dielectric material and electrolytic-plated Cu. Because adhesion strength is affected by the type of metal surface treatment prior to polymer coating, it is important to find a practical method for Cu surface treatment wafer process. Three types of treatment methods, including plasma, thermal, and wet process, were tried on the plated Cu surface. X-ray photoelectron spectroscopy (XPS) results are reported for the surface properties after treatment. Adhesion strength between the polymer layer and the Cu surface is reported as measured by manual tape, nano-indentation scratch, and four-point bending methods. Our results show that cleaning the Cu surface with dilute acetic acid significantly increases the adhesion between Cu and the polymer layer. We also report results for the change in Cu surface properties as a function of time after clean.
Starting Page	1106
Ending Page	1111
File Size	1295101
Page Count	6
File Format	PDF
ISBN	9781424464104
ISSN	05695503
e-ISBN	9781424464128
e-ISBN	9781424464111
DOI	10.1109/ECTC.2010.5490840
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Copper Surface treatment Polymer films Plasma measurements Surface cleaning Wafer scale integration Dielectric materials Plasma applications Plasma properties
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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