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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fuhan Liu Sundaram, V. Sunghwan Min Sridharan, V. Chan, H. Kumbhat, N. Baik-Woo Lee Tummala, R. Baars, D. Kennedy, S. Paul, S. |
| Copyright Year | 2010 |
| Description | Author affiliation: Rogers Corporation, One Technology Drive, Rogers, CT 06263, USA (Baars, D.; Kennedy, S.; Paul, S.) || Packaging Research Center, School of Electrical and Computing Engineering, Georgia Institute of Technology, 813 Ferst Drive, Atlanta, GA 30332, USA (Fuhan Liu; Sundaram, V.; Sunghwan Min; Sridharan, V.; Chan, H.; Kumbhat, N.; Baik-Woo Lee; Tummala, R.) |
| Abstract | This paper presents for the first time a novel manufacturing-compatible organic substrate and interconnect technology using ultra-thin chip-last embedded active and passive components for digital, analog, MEMS, RF, microwave and millimeter wave applications. The architecture of the platform consists of a low-CTE thin core and minimum number of thin build up organic dielectric and conductive layers. This organic substrate is based on a new generation of low-loss and thermally-stable thermosetting polymers (RXP-1 and RXP-4). Unlike LCP- and Teflon-based materials, the RXP material system is fully compatible with conventional FR-4 manufacturing processes. Ultra-thin silicon test die (55µm thick) has been embedded in a 60µm deep cavity with a 6-metal layer RXP substrate and a total thickness of 0.22mm. The embedded IC is interconnected to the substrate by ultra-fine pitch Cu-to-Cu bonding with polymer adhesives. This novel interconnection process performed at 180°C, has passed 1,000 thermal shock cycles in reliability testing. Because of manufacturing process simplicity and unparalleled set of benefits, the chip-last technology described in this paper provides the benefits of chip-first without its disadvantages and thus enables highly miniaturized, multi-band, high performance 3D modules by stacking embedded 3D ICs or packages with embedded actives, passives and MEMS devices. |
| Starting Page | 758 |
| Ending Page | 763 |
| File Size | 1222908 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424464104 |
| ISSN | 05695503 |
| e-ISBN | 9781424464128 |
| e-ISBN | 9781424464111 |
| DOI | 10.1109/ECTC.2010.5490757 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Packaging Dielectric substrates Millimeter wave technology Liquid crystal polymers Conducting materials Dielectric materials Manufacturing processes Testing Pulp manufacturing Components, packaging, and manufacturing technology |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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