NDLI: Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling

Content Provider	IEEE Xplore Digital Library
Author	Brusberg, L. Schröder, H. Erxleben, R. Ndip, I. Töpper, M. Nissen, N.F. Reichl, H.
Copyright Year	2010
Description	Author affiliation: Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin/Germany (Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.)
Abstract	Glass as a carrier material for electrical and optical interconnects has many benefits compared to conventional materials like silicon, ceramic or polymer based laminates because of its excellent dielectric and transparent properties that are becoming important for electrical high-frequency signal wiring as well as for optical wave guiding. Furthermore, the integration potential of glass is excellent because of the dimensional stability under thermal load and the coefficient of thermal expansion matching that of silicon ICs. A small pitch size of conductor traces, small scale through-vias and high alignment accuracy are the key requirements that will be achieved from glass carrier based packaging. Another outstanding benefit is the transparency of glass that allows the planar integration of optical waveguides inside the glass core material and the light transmission through the carrier between different optical layers. This paper presents a four channel bi-directional optoelectronic transceiver module that was designed and processed using the glass carrier based packaging approach called glassPack. The transceiver operates with 10 Gbps per channel and has an extremely low power consumption of 592 mW. The module is mounted on a printed circuit test board and the performance is characterized by bit error rate testing.
Starting Page	269
Ending Page	274
File Size	841347
Page Count	6
File Format	PDF
ISBN	9781424464104
ISSN	05695503
e-ISBN	9781424464128
e-ISBN	9781424464111
DOI	10.1109/ECTC.2010.5490961
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Packaging Transceivers Assembly Circuit testing Optical materials Dielectric materials Optical interconnections Silicon Optical polymers
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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