NDLI: F1: Silicon 3D-integration technology and systems

Content Provider	IEEE Xplore Digital Library
Author	Urard, Pascal Takeuchi, Ken Bernstein, Kerry Hidaka, Hideto Phan, Michael Choi, Joo Sun Payne, Bob Stojanovic, Vladimir Berkel, Kees Van Sakurai, Takayasu
Copyright Year	2010
Description	Author affiliation: Samsung Electronics, Hwasung, Korea (Choi, Joo Sun) \|\| Qualcomm, Raleigh, NC, USA (Phan, Michael) \|\| MIT, Cambridge, MA, USA (Stojanovic, Vladimir) \|\| Applied Research Associates, Williston, VT, USA (Bernstein, Kerry) \|\| Renesas Techonology, Itami, Japan (Hidaka, Hideto) \|\| ST- Ericsson, Eindhoven, The Netherlands (Berkel, Kees Van) \|\| University of Tokyo, Japan (Takeuchi, Ken; Sakurai, Takayasu) \|\| Texas Instruments, Dallas, USA (Payne, Bob) \|\| STMicroelectronics, Crolles, France (Urard, Pascal)
Abstract	This whole-day forum offers a complete overview of the existing and emerging 3D-techniques enabling higher interconnectivity between circuit components. It aims to show the advantages of these techniques such as reduced cost, lower power consumption and ease of integration of new generations of System-in-Package (SiP). Designers face different problems which are specific to the application segments such as imagers, battery operated devices, SSD, etc. This forum looks into these problems and presents different 3D-solutions.
Starting Page	510
Ending Page	511
File Size	1454033
Page Count	2
File Format	PDF
ISBN	9781424460335
ISSN	01936530
e-ISBN	9781424460366
DOI	10.1109/ISSCC.2010.5433859
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-07
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Integrated circuit technology CMOS technology Baseband Batteries Through-silicon vias Cameras Chip scale packaging Stacking Circuit synthesis
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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