NDLI: Development of embedded power electronics modules

Content Provider	IEEE Xplore Digital Library
Author	Boettcher, Lars Karaszkiewicz, Stefan Manessis, Dionysios Ostmann, Andreas
Copyright Year	2012
Description	Author affiliation: Fraunhofer Institute for Reliability and Microintegration (IZM) (Boettcher, Lars; Karaszkiewicz, Stefan; Ostmann, Andreas) \|\| Technical University of Berlin, Gustav-Meyer-Allee 25, 13355 Berlin, Germany (Manessis, Dionysios)
Abstract	The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to solve these challenges. During the past decade embedding of semiconductor chips into PCB structures evolved from a research topic to volume production. The paper will briefly describe this development and categorize today's embedding technologies. First modules with embedded chips are in production in Asia and Europe, mainly for mobile applications. In Europe embedding has gained a strong interest for power modules, especially in automotive applications. Main drivers are the capability for compact and thin packaging, the high reliability and cost saving potential. The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Embedding of power switches, and controller into compact modules using PCB (Printed Circuit Board) technologies offers the potential to reduce the thickness and size of the module. In order to replace DCB ceramics, a structure of thermal laminate material between Cu layers has been developed and the capability for thermal conduction and electrical insulation has been evaluated. For the assembly of large power IGBTs with sizes of 100 mm² and larger, new silver sintering pastes have been evaluated. They enable a pressure-less sintering at 200 °C, compatible with PCB materials. To handle the high switching current of up to 200 A, suitable copper tracks in the PCB are required. The realization of such thick copper lines with thickness up to 1 mm requires advanced processing, compared to conventional multilayer PCB production. In order to form complex power systems out of modules with embedded chips interconnections by Ag sintering are under development.
Starting Page	1
Ending Page	6
File Size	1717540
Page Count	6
File Format	PDF
ISBN	9781467346450
e-ISBN	9781467346443
DOI	10.1109/ESTC.2012.6542167
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-09-17
Publisher Place	Netherlands
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	System in Package PCB technology embedded actives and passives power electronics 3D packaging embedded components
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Integration of electronic components into PCB for electromobility application

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications

Development of GE's plastic thin-zero outline package (TZOP) technology

Multi-layer Organic with Embedded Passives and Actives

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Development of low-k interlayer dielectric film for embedded passives and actives integral substrates

Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs

Development of embedded power electronics modules

Similar Documents

Integration of electronic components into PCB for electromobility application

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications

Development of GE's plastic thin-zero outline package (TZOP) technology

Multi-layer Organic with Embedded Passives and Actives

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Development of low-k interlayer dielectric film for embedded passives and actives integral substrates

Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs

Development of embedded power electronics modules