NDLI: Polymer interfacial adhesion in microelectronic assemblies

Content Provider	IEEE Xplore Digital Library
Author	Dai, X. Brillhart, M.V. Ho, P.S.
Copyright Year	1998
Description	Author affiliation: Texas Univ., Austin, TX, USA (Dai, X.)
Abstract	The performance requirements of future electronic packages create the need for transition from traditional wire bond connections to advanced technologies such as flip chip on laminate and direct chip attach. These high performance connections utilize a particulate reinforced structural epoxy (underfill) to adhere the chip to the package or board. The integrity of the underfill/silicon chip and underfill/substrate (ceramic or polymer laminates) interfaces are crucial for the reliability of these chip attach methods. This paper presents fracture-mechanics-based experimental and analytical techniques for quantitatively and reproducibly determining the adhesive performance of chip/underfill and polymer substrate/underfill interfaces. The results of the adhesion studies on underfill/passivated silicon and underfill/polymer coated FR4 board interfaces are presented. The effects of different underfill formulations, board coatings and chip passivation layers on underfill interfacial performance are discussed. These techniques can be employed to rapidly evaluate new materials and examine process modification impact on adhesive performance in a wide range of environments.
Starting Page	132
Ending Page	137
File Size	657305
Page Count	6
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678682
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Adhesives Microelectronics Assembly Electronics packaging Laminates Silicon Wire Bonding Flip chip
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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