NDLI: A study of high density and reliability BGA package with solder ball lands of oval type

Content Provider	IEEE Xplore Digital Library
Author	Kim, S.J. Lee, C.H. Lee, S.G. Syed, A.
Copyright Year	1998
Description	Author affiliation: R&D Center, Anam Semicond., Seoul, South Korea (Kim, S.J.)
Abstract	In this paper, we propose the solder ball lands of oval type for the laminated substrate design of BGA. With this design concept, the ball shear strength test was performed for the relative comparison between conventional (spherical) type and a proposed oval type. In the case of oval type pad design, the minimum and average value of solder ball shear were increased relative to circular type pad and its standard deviation value was decreased. Additionally, oval type lands can allow the designers to insert at least 50% more traces between adjacent unit-pitched-solder ball lands than conventional design so that better traceability for this small sized packages can be obtained. The simulation result of solder ball fatigue life with BGA package was covered in this paper.
Starting Page	680
Ending Page	684
File Size	909388
Page Count	5
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678771
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor device packaging Electronic packaging thermal management Routing Lead Thermal stresses Manufacturing Electronics packaging Research and development Substrates Testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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