NDLI: The execution of aggressive PBGA substrate yield learning in an existing PWB facility

Content Provider	IEEE Xplore Digital Library
Author	Fuller Jr., J.W. Norton, E.M.
Copyright Year	1998
Description	Author affiliation: IBM Corp., USA (Fuller, J.W., Jr.)
Abstract	As the market for PBGA products explodes and substrate facilities are designed, built, and brought on line, yield learning is vitally important. It is rare that a new product will be introduced at its steady state yield target, necessitating aggressive yield improvement planning. In particular, manufacturers who have converted portions of existing PWB capacity to PBGA product sets will find this to be true. In this paper, the authors articulate the significant challenges manufacturers face ramping up PBGA product. Complex logistics, multiple process flows, multiple customer requirements, aggressive delivery schedules, non-PWB defect mechanisms, non-functionally defined engineering specifications, and a paradigm shift in manufacturing philosophy complicate a product with great intrinsic manufacturing difficulty. This paper reviews in detail the challenges, philosophy and methodology employed to achieve dramatic improvement in PBGA product yields. The paper also includes suggestions for changes in business process procedures to ensure yield learning is engrained as part of any PBGA product introduction. A detailed system of matrix management that utilized process control as the foundation for yield improvement is included. The organization structure, review cycle, improvement road maps, yield tracking and data analysis are discussed in detail. Overall yield improvement results, along with several representative products, are generically shared to validate the philosophy and methodology employed.
Starting Page	834
Ending Page	837
File Size	462887
Page Count	4
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678804
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Substrates Microelectronics Manufacturing processes Process control Random access memory Gold Steady-state Capacity planning Pulp manufacturing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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